- Single system for the inspection of the PCBs top side.
- Combination of diverse inspection tasks such as SMD placement, THTsolder joints, conformal coating and full screening for solder bead(solderballs).
- Capture of barcode and data-matrix codes in any position and quantity onthe multi PCB.
- Scan range 310 x 410 mm (11.8 in./15.8 in.).
Max. resolution 600 – 1200 dpi, 42µm-21µm
Color intensity 3 x 12 bit internal, 3×8 bit external
Scan range 300 mm x 410 mm [11.8 in. x 16.1 in.]
Fotoelectrical prinzip: CCD line sensor RGB 14600 pixels x 3
Effective pixels: 859 megapixels, optical density: 3.0
Light source: multi-LED illumination, standard white red and blue optional UV LED 365 nm focused, Interface: SCSI-II, 68 pin
Telecentric lens for parallax free image
Rectified image because of ortogonal calibration
Operation range 300 mm x 410 mm [11.8 in. x 15.8 in.]
Clearance BOT max 40mm, TOP up to 60mm [ 1.6 in. 2.3 in.]
PCB-area 300 mm x 410 mm [11.8 in. x 15.8 in.] independent of the number of inspection parts: 25 seconds (incl. calculation time)
Contact Cardinal Circuit using the form below or email firstname.lastname@example.org for additional information or inquiries.
FAST response, within a hour or less.